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ENIG Multilayer PCB Fabrication , FR4 PCB Multi Circuit Boards 18 Layers High Frequency

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Shenzhen Jingxin Electronic Technology Co., Ltd.

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ENIG Multilayer PCB Fabrication , FR4 PCB Multi Circuit Boards 18 Layers High Frequency

Name: ENIG Multilayer PCB Fabrication FR4 PCB Multi Circuit Boards 18 Layers High Frequency
Brand: JINGXIN
Price: 1 USD

Best ENIG Multilayer PCB Fabrication , FR4 PCB Multi Circuit Boards 18 Layers High Frequency wholesale

Brand Name : JINGXIN

Model Number : JX18112724

Certification : UL, Rohs

Place of Origin : CHINA

MOQ : 1 PC

Price : Negotiation

Payment Terms : L/C, D/A, D/P, T/T, Western Union, MoneyGram

Supply Ability : 30000pcs per day

Delivery Time : 5-7 days

Packaging Details : ESD Bag

Surface Finishing : ENIG

Number Of Layer : 18 Layers

Customized : YES

Legend : White

Quote needs : PCB Gerber file

Product Type : RGD ROHS PCB

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High frequency ENIG Multilayer PCB Board Supply FR4 PCB Board 18 layers

JXE has over 16 years experience on electronics components purchasing area. 15 procurement engineers all have at least 5 years experience of components sourcing. We purchase components both from mainland China and overseas countries. JXE fast turnaround service combined with enhanced parts procurement system will cater to the customers who require both small volume and large volume production demands

18 layers Multilayer PCB board

The details include

1. PCB Gerber files.
2. BOM list for PCB assembly.
3. Send us your sample PCB or PCBA.
4. OEM is acceptable.

PCB Capacity

PCB General Capability
Number of Layer	1 - 18 Layer
Maximum Processing Area	680 × 1000MM
Min Board Thickness	2 Layer - 0.3MM ( 12 mil )
	4 Layer - 0.4MM ( 16 mil )
	6 Layer - 0.8MM ( 32 mil )
	8 Layer - 1.0MM ( 40 mil)
	10 Layer - 1.1MM ( 44 mil )
	12 Layer - 1.3MM ( 52 mil )
	14 Layer - 1.5MM ( 59 mil )
	16 Layer - 1.6MM ( 63 mil )
	18 Layer - 1.8MM ( 71 mil )
Finished Board Thickness Tolerance	Thickness ≤ 1.0MM, Tolerance: ± 0.1MM
Finished Board Thickness Tolerance	1.0MM ≤ Thickness ≤ 6.5MM, Tolerance ± 10%
Twisting and Bending	≤ 0.75%, Min: 0.5%
Range of TG	130 - 215 ℃
Impedance Tolerance	± 10%, Min: ± 5%
Hi-Pot Test	Max: 4000V/10MA/60S
Surface Treatment	HASL, With Lead, HASL Free Lead
	Flash Gold, Immersion Gold
	Immersion Silver, Immersion Tin
	Gold Finger, OSP

PCB Cu Thickness + Plating
Out Layer Cu Thickness	1 - 6OZ
Inner Layer Cu Thickness	0.5 - 4OZ
Cu Thickness of PTH	20UM ≤ Average ≤ 25UM
Cu Thickness of PTH	Min: 18UM
HASL with Lead	Tin 63% Lead 37%
HASL Free Lead	7UM ≤ Surface Thickness ≤ 12UM
Thick Gold Plating	Ni Thickness: 3 - 5UM ( 120u" - 200u" )
Thick Gold Plating	Gold Thickness: 0.025 - 1.27UM ( 1u" - 50u" )
Immersion Gold	Ni Thckness: 3 - 5UM ( 120u" - 200u" )
Immersion Gold	Gold Thickness: 0.025 - 0.15UM ( 1u" - 3u" )
Immersion Silver	Ag Thickness: 0.15- 0.75 UM ( 6u" - 30u" )
Gold Finger	Ni Thickness: 3 - 5UM ( 120u" - 160u" )
Gold Finger	Gold Thickness: 0.025 - 1.51UM ( 1u" - 60u" )

U940 PCB Pattern Limit Capability
Min Width	0.075MM ( 3 mil )
Min Trace	0.075MM ( 3 mil )
Min Width of Ring ( Inner Layer )	0.15MM ( 6 mil )
Min Width of Ring ( Out Layer )	0.1MM ( 4 mil )
Min Solder Bridge	0.1MM ( 4 mil )
Min Height of Legend	0.7MM ( 28 mil )
Min Width of Legend	0.15MM ( 6 mil )

PCB Holes Processing Capability
Final Hole Size	Min: Laser 0.1MM, Machine 0.2MM
Drilling Hole Size	0.10 - 6.5MM
Drilling Tolerance	NPTH: ±0.05MM, PTH: ±0.075MM
Final Hole Size Tolerance ( PTH )	φ0.20 - 1.60MM ± 0.075MM
Final Hole Size Tolerance ( PTH )	φ1.60 - 6.30MM ± 0.10MM
Final Hole Size Tolerance ( NPTH )	φ0.20 - 1.60MM ± 0.05MM
Final Hole Size Tolerance ( NPTH )	φ1.60 - 6.50MM ± 0.05MM
Drilling Strip Hole	-0L ~tu.'gth /width 2:1
	Min Strip Hole Width 0.65MM
	Length & Width Tolerance ± 0.05MM
Board Thickness / Hole Size	≤ 10:1

PCB Cover Thickness Capability
Solder Mask Color	Green,Matte Green,Yellow,Blue,Red,Black,Matte Black,White
Solder Mask Thickness	Surface Line ≥ 10UM
	Surface Line Corner ≥ 6UM
	Surface Board 10 - 25UM
	Solder Mask Bridge Width
Legend Color	White,Yellow,Black
Min Height of Legend	0.70MM ( 28 mil )
Min Width of Legend	0.15MM ( 6 mil )
Blue Gel Thickness	0.2 - 1.5MM
Blue Gel Tolerance	±0.15MM
Carbon Print Thickness	5 - 25UM
Carbon Print Min Space	0.25MM
Carbon Print Impedance	200Ω

Blind/Burried/Half Via PCB Capability
Parameters	(1+1)e.g. (4-layer)blind via:1-2,2-4 (6-layer)buried via:2-3,3-4 (8-layer)blind/buried:1-3,4-5,6-8
Min Via	Laser 0.1MM, Machine 0.2MM
Half Via	Min: 0.6MM

Impedance Capability
Resistance Value	Single-ended 50 - 75Ω, Difference 100Ω, Coplanar 50 - 75Ω

PCB Photos

Product Tags:

multi circuit boards

multilayer pcb fabrication

ENIG Multilayer PCB Fabrication , FR4 PCB Multi Circuit Boards 18 Layers High Frequency Images

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